Kaisi
Kaisi 18 in 1 Silicone Middle Layer Tin Planting BGA Reballing Platform for iPhone X-14 Pro Max
Kaisi 18 in 1 Silicone Middle Layer Tin Planting BGA Reballing Platform for iPhone X-14 Pro Max
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FREE Shipping
FREE Shipping
FREE SHIPPING on all orders. Fully Insured.
Handling time 1 - 3 working days. (PMC has to process your order and put all your items through its strict quality-control tests.)
Transit time 7 - 15 working days.
Get It Now, Pay Later
Get It Now, Pay Later
Pay using Mobicred. Simply choose Peach Payment >> Mobicred at checkout, and we’ll ship it once the order is approved.
Return Guarantee
Return Guarantee
For whatever reason if you are unsatisfied with your order within 7 days you can return it to us in new condition for a refund minus the shipping charges.
Payment & Security
Payment & Security
Your payment information is processed securely. We do not store credit card details nor have access to your credit card information.
Missing/Wrong Items Guarantee
Missing/Wrong Items Guarantee
If you receive a parcel with missing/incorrect/secondary packing items, please contact us within 7 days of delivery and provide the relevant proof. PMC will make compensation based on the damage situation.
2. Super magnetic force / multi-model infinite extension base / precise positioning and close fit
3. Precise positioning / fast tin planting / strong magnetic adsorption
4. Built-in three high-temperature strong magnets, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetism
5. Steel material, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls
6. Anti-drum, so that each solder ball is round and full, to meet the needs of various chips
7. With precise positioning, it is more convenient to align the whole position
8. Silicone material is used to effectively isolate temperature and prevent scalding
9. The real machine is measured to ensure accuracy, and each detail, hole position, and mesh is proofread according to the original drawings to ensure that every solder joint cannot be missing
